Welcome to the official website of 2023 the 6th International Conference on Smart Materials Applications (ICSMA 2023) will take place in Tokyo, Japan during January 06-08, 2023. ICSMA2023 is co-organized by South Asia Institute of Science and Engineering (SAISE), Sichuan University, China, Yonsei University, South Korea and Tokyo University of Science, Japan.. The conference program covered invited, oral and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas with the aim of developing new projects and exploiting new technology in this field.
All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Scopus.
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ICSMA 2022 Virtual Conference January 21-24, 2022 |
ICSMA 2021 Virtual Conference January 21-24, 2021 |
ICSMA 2020 Yonsei University, Seoul, South Korea January 13-16, 2020 |
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ICSMA 2019 Tokyo University of Science, Japan January 19-22, 2019 |
ICSMA 2018 National University of Singapore, Singapore January 26-28, 2018 |
Full Paper Submission Deadline | November 20th, 2022 |
Abstract Submission Deadline | November 20th, 2022 |
Notification Date |
December 01st, 2022 |
Registration Deadline |
December 07th, 2022 |
Sponsored by |
Technical Sponsored by |
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