2018 International Conference on Smart Materials Applications (ICSMA 2018) will take place in Singapore during January 26-28, 2018. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.
National University of Singapore
Shaw Foundation Alumni House
Submissions will be peer reviewed by 2-3 reviewers. The registered and presented papers will be published into
IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981),
which is indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
To publish the full paper into conference proceedings and give the oral presentations, please send us the full paper. To give presentation only, please just send us the abstract.
|Submission Deadline:||November 30th, 2017|
|Notification Date:||December 15th, 2017|
|Registration Deadline:||December 30th, 2017|
|Conference Dates:||January 26-28, 2018|