Welcome to the official website of the 2019 2nd International Conference on Smart Materials Applications (ICSMA 2019) will take place in Tokyo, Japan during January 19-21, 2019. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.
Acceptance Notice: 25-September.-2018
Registration Due: 15-October-2018
Conference dates: 19-21-January-2019.
All submissions will be peer reviewed, the registered and presented papers will be published into IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981), which is indexed by SCOPUS, Ei Compendex (CPX).
Topics of interest include (but not limited to) the following:
ICSMA 2019 will be held in Tokyo, Japan during January 19-21, 2019 ! Looking forward to see you again.---- May. 12th, 2018
ICSMA 2018 was successfully held in Singapore during January 26-28, 2018! (Read More) ---- Jan. 31st, 2018
Submission deadline of ICSMA2018 has been extended to November 30! ---- Nov. 11th, 2017
Welcome Assoc. Prof. Achanai Buasri and Dr.Huynh Trong-Phuoc join in conference technical committees! ---- Sept. 07th, 2017