Welcome to the official website of 2027 the 10th International Conference on Smart Materials Applications (ICSMA 2026). The Conference will be held at Sapporo, Japan during January 8-10, 2027. ICSMA2027 is co-organized by South Asia Institute of Science and Engineering (SAISE); Tokyo University of Science, Japan; Yonsei University, South Korea and Sichuan University, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

 

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All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS.