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Welcome to ICSMA 2026 @ Tokyo, Japan

Welcome to the official website of 2026 the 9th International Conference on Smart Materials Applications (ICSMA 2026). The Conference will be held at Tokyo University of Science, Tokyo, Japan during January 19-21, 2026. ICSMA2026 is co-organized by South Asia Institute of Science and Engineering (SAISE); Tokyo University of Science, Japan; Yonsei University, South Korea and Sichuan University, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

 


Conference Proceedings

All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS.

Submission Information

Submission Method

01

Template Download

a. TTP_template.doc
b. Abstract-Template.doc
Only Full paper submission will be published in conference proceedings if accepted.

02

Submission Link

Click on the following link URL : http://confsys.iconf.org/submission/icsma2026

03

Contact Us

For any inquiry about the conference, please feel free to contact us at: icsma@saise.org

Critical Dates

05
Sept.
September 5th, 2025

Submission Deadline

25
Sept.
September 25th, 2025

Notification Date

15
Oct.
October 15th, 2025

Registration Deadline

19
Jan.
January 19-21, 2026

Conference Date

History

Previous ICSMA

Yonsei University, Seoul, South Korea

ICSMA 2025

Singapore

ICSMA 2024

Tokyo, Japan

ICSMA 2023

Yonsei University, Seoul, South Korea

ICSMA 2020

Tokyo University of Science, Japan

ICSMA 2019

Singapore

ICSMA 2018